Title:
電子機器
Document Type and Number:
Japanese Patent JP7420482
Kind Code:
B2
Abstract:
An electronic device 2 includes a housing 4, a circuit substrate 6, a connector 8, and a seal 38 obtained by a sealant having fluidity being hardened. The housing 4 includes a lower case 10 and an upper case 12 that covers the lower case 10. The connector 8 is disposed between the upper case 12 and the lower case 10. The lower case 10 has a case groove 18. A connector projection 30 disposed on the connector 8 and a case projection 24 disposed on the upper case 12 are fitted into the case groove 18. The connector 8 includes a connector groove 32, and the case projection 24 is fitted into the connector groove 32. An obstructor for inhibiting flow of the sealant is disposed in the case groove 18 or the connector groove 32.
Inventors:
Tatsuya Ohgami
Hiroki Nakata
Hiroki Nakata
Application Number:
JP2019091563A
Publication Date:
January 23, 2024
Filing Date:
May 14, 2019
Export Citation:
Assignee:
Dai Zebra Electric Co., Ltd.
International Classes:
H05K5/02; H01R13/52
Domestic Patent References:
| JP2014116504A | ||||
| JP201874097A | ||||
| JP545327U | ||||
| JP2013119910A |
Attorney, Agent or Firm:
Ariko Patent Office