Title:
基材表面を金属でコーティングするための電気めっき用組成物
Document Type and Number:
Japanese Patent JP5235669
Kind Code:
B2
Abstract:
The object of the present invention is an electroplating composition intended in particular for coating a copper-diffusion barrier layer with a seed layer, This composition comprises a source of copper ions, in a concentration of between 0.4 and 40mM; at least one copper complexing agent chosen from the group of primary aliphatic amines, secondary aliphatic amines, tertiary aliphatic amines, aromatic amines, nitrogen heterocycles and oximes; the copper/complexing agent(s) molar ratio being between 0.1 and 2.5, preferably between 0.3 and 1.3; and the pH of the composition being less than 7, preferably between 3.5 and 6.5.
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Inventors:
Jerome, Davio
Gonzalez, Jose
Gonzalez, Jose
Application Number:
JP2008531756A
Publication Date:
July 10, 2013
Filing Date:
September 20, 2006
Export Citation:
Assignee:
Al-Smile
International Classes:
C25D3/38; C25D7/12; H01L21/28; H01L21/288; H01L21/3205; H01L21/768; H01L23/532
Domestic Patent References:
| JP53035898B1 | ||||
| JP5230687A | ||||
| JP2000273684A | ||||
| JP2002285377A | ||||
| JP2002004081A | ||||
| JP2002327278A | ||||
| JP6287791A | ||||
| JP2004346422A | ||||
| JP2002506927A |
Foreign References:
| WO2005008759A1 |
Attorney, Agent or Firm:
Atomi International Patent Office
Yasuo Yasutomi
Fumio Akiyama
Yasuo Yasutomi
Fumio Akiyama