Title:
ELECTROPLATING METHOD
Document Type and Number:
Japanese Patent JPH04116191
Kind Code:
A
Abstract:
PURPOSE:To obtain a plating film having superior throwing power by using an electroplating soln. contg. a halogen-free water-soluble salt of a metal such as Ni, a water-soluble salt of an alkali or alkaline earth metal and boric acid as a buffer but not contg. a halide. CONSTITUTION:A plating soln. contg. 100-500g/l water-soluble sulfate of an alkali or alkaline earth metal or Al as an electrically conductive salt, 10-200g/l halogen-free water-soluble salt of Ni, Co or Fe as a metal ion feeding source and 1-50g/l boric acid as a buffer is prepd. A body to be plated is immersed in the plating soln. and electroplated with an insoluble electrode as the anode.
Inventors:
MURAKAMI TORU
Application Number:
JP23429490A
Publication Date:
April 16, 1992
Filing Date:
September 04, 1990
Export Citation:
Assignee:
UEMURA KOGYO KK
International Classes:
C25D3/12; C25D3/20; (IPC1-7): C25D3/12; C25D3/20
Domestic Patent References:
| JPS62109991A | 1987-05-21 | |||
| JPS6256591A | 1987-03-12 |
Attorney, Agent or Firm:
Takashi Kojima