ELECTROSTATIC CHUCK DEVICE

Title:

ELECTROSTATIC CHUCK DEVICE

Document Type and Number:

Japanese Patent JPH09321128

Kind Code:

A

Abstract:

To provide an electrostatic chuck device which enables uniform plasma processing of a substrate surface.

Two electrodes 21, 22 formed in a flat shape are located substantially in the same plane. An insulating material 3 is provided on the surface of each of the electrodes 21, 22, and a substrate 4 is arranged on the surface of the insulating material 3. When a voltage is applied between the electrodes 21, 22 to perform electrostatic attraction, the spacing between the two electrodes 21, 22 is caused to be not greater than five times the thickness of the insulating material 3 on the electrodes 21, 22. The capacitance value between the substrate 4 and the electrodes 21, 22 becomes substantially uniform at any point, thus enabling uniform plasma processing of the surface of the substrate 4. It is preferred that the spacing between the electrodes 21, 22 is narrowed within such a range that static damage is not generated. However, in the case where the maximum applied voltage is determined, the magnitude of a current which flows on application of that voltage between the electrodes 21, 22 may be caused to be not greater than the magnitude of a predetermined leakage current.

Inventors:

SUNADA TAKESHI
FUJIMOTO HIDEKI
KIKUCHI MASASHI
WATANABE MIDORI

Application Number:

JP16108296A

Publication Date:

December 12, 1997

Filing Date:

May 31, 1996

Export Citation:

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Assignee:

ULVAC CORP

International Classes:

H05H1/46; B23Q3/15; H01L21/302; H01L21/3065; H01L21/68; H01L21/683; H02N13/00; (IPC1-7): H01L21/68; B23Q3/15; H01L21/3065; H02N13/00; H05H1/46

Attorney, Agent or Firm:

石島茂男（外１名）

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