To provide an electrostatic chuck capable of reducing local thermal deformation of a wafer by equalizing the temperature of a refrigerant, and an exposure apparatus provided with this electrostatic chuck.

In the electrostatic chuck provided with a attraction surface for attracting a substrate in a chuck body, a refrigerant passage for allowing the refrigerant to flow from an inflow section of the refrigerant to an outflow section is formed on the chuck body, and the refrigerant passage of the inflow section and the refrigerant passage of the outflow section are alternately formed. The refrigerant passage is formed into a spiral shape. The inflow section and the outflow section are formed on the center of the chuck body.