Title:
高温RF用途のための静電チャック
Document Type and Number:
Japanese Patent JP6796066
Kind Code:
B2
Abstract:
An electrostatic chuck includes a puck having a support surface to support a substrate when disposed thereon and an opposing second surface, wherein one or more chucking electrodes are embedded in the puck, a body having a support surface coupled to the second surface of the puck to support the puck, a DC voltage sensing circuit disposed on support surface of the puck, and an inductor disposed in the body and proximate the support surface of the body, wherein the inductor is electrically coupled to DC voltage sensing circuit, and wherein the inductor is configured to filter high frequency current flow in order to accurately measure DC potential on the substrate.
Inventors:
Hansung Liang
Coppa Manjunasa
Parke Vijay Dee
Forster Johnsea
Mirror Keith A
Coppa Manjunasa
Parke Vijay Dee
Forster Johnsea
Mirror Keith A
Application Number:
JP2017529626A
Publication Date:
December 02, 2020
Filing Date:
December 08, 2015
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H02N13/00; C23C14/50; H01L21/683
Domestic Patent References:
JP2001338917A | ||||
JP2000507745A | ||||
JP8191099A | ||||
JP4053134A | ||||
JP8335567A | ||||
JP11330218A | ||||
JP2009188342A | ||||
JP2013535842A | ||||
JP2009170509A |
Foreign References:
US6673636 | ||||
KR819078B1 | ||||
US20090178764 |
Attorney, Agent or Firm:
Shinichiro Tanaka
Hiroyuki Suda
Fumiaki Otsuka
Takaki Nishijima
Hiroshi Uesugi
Naoki Kondo
Takeo Nasu
Hiroyuki Suda
Fumiaki Otsuka
Takaki Nishijima
Hiroshi Uesugi
Naoki Kondo
Takeo Nasu