Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTROSTATIC CHUCK FOR VACUUM BONDING EQUIPMENT AND VACUUM BONDING EQUIPMENT USING SAME
Document Type and Number:
Japanese Patent JP2008026338
Kind Code:
A
Abstract:

To prevent breakage of an electrostatic attraction functioning part due to biting of a foreign material.

At least one layer of a dielectric protecting layer 1c having a prescribed thickness is provided on a surface of a dielectric layer 1b; a portion between a board contact plane 1' of the dielectric protecting layer 1c arranged on the outermost side and an electrode layer 1a is permitted to have a laminate structure composed of a plurality of layers; and thereby, a distance between the board contact plane 1' and the electrode layer 1a is increased by the thickness of the dielectric protecting layer 1c. This reduces the probability of causing damages to the electrode layer 1a due to biting of a large foreign material, as well as, even when the board contact plane 1' of the dielectric protecting layer 1c is scratched by biting of a small foreign material, cracks do not reach the dielectric layer 1a by being prevented from advancing by the dielectric protecting layer 1c. When the layer constitution is divided while maitaining the entire thickness from the board contact plane 1' to the electrode layer 1a substantially the same, cracks do not reach the dielectric layer 1a by being prevented from advancing by the dielectric protecting layer 1c in the same manner.


Inventors:
OTANI YOSHIKAZU
SHIMA TAKESHI
KAWASE RITSU
Application Number:
JP2004316173A
Publication Date:
February 07, 2008
Filing Date:
October 29, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHINETSU ENG CO LTD
TOMOEGAWA PAPER CO LTD
International Classes:
G09F9/00; G02F1/13; H01L21/683
Attorney, Agent or Firm:
Sadayuki Hosoi
Mitsuo Chonan
Ishiwatari Eibo
Nakamura Masamichi



 
Previous Patent: 空気入りタイヤ

Next Patent: DISPLAY DEVICE