Title:
ELECTROSTATIC CHUCK
Document Type and Number:
Japanese Patent JP2020167405
Kind Code:
A
Abstract:
To provide an electrostatic chuck capable of suppressing peeling of a ceramic dielectric substrate from a base plate or cracking of the ceramic dielectric substrate in a cryogenic environment.SOLUTION: The electrostatic chuck includes: a ceramic dielectric substrate; a metal base plate for supporting the ceramic dielectric substrate; and a bonding layer, provided between the ceramic dielectric substrate and the base plate, containing a resin material. Bonding strength β1 of the bonding layer at -60°C is 0.4 MPa or more and 10 MPa or less.SELECTED DRAWING: Figure 6
Inventors:
MOMIYAMA DAI
SASAKI HITOSHI
SASAKI HITOSHI
Application Number:
JP2020051447A
Publication Date:
October 08, 2020
Filing Date:
March 23, 2020
Export Citation:
Assignee:
TOTO LTD
International Classes:
H01L21/683; H01L21/205; H01L21/3065; H02N13/00
Domestic Patent References:
| JP2020023088A | 2020-02-13 | |||
| JPH04287344A | 1992-10-12 | |||
| JPH07183279A | 1995-07-21 | |||
| JP2012142413A | 2012-07-26 | |||
| JP2014207374A | 2014-10-30 | |||
| JPH0786381A | 1995-03-31 |
Attorney, Agent or Firm:
Masahiko Hinataji
Junichi Kozaki
Hiroshi Ichikawa
Junichi Kozaki
Hiroshi Ichikawa