To provide an electrostatic chucking device of a structure, and a laminated sheet for electrostatic chuck, wherein the deterioration of the flatness of the suction surface of a wafer and separation of bonding agent layers from a ceramic board can be prevented for a long period and, moreover, the heat dissipation property of the wafer is favorable.

This device is provided with a metal board 10, a first bonding agent layer 14 provided on this board 10 and a ceramic insulating sheet 16 provided on this layer 14. The layer 14 and a second bonding agent layer 18 contain one kind of a copolymer or two kinds or more of copolymers, which is or are selected from among an acrylonitrile-budadiene copolymer, an olefin copolymer and a polyphenyl ether copolymer, and a hindered phenol anti- oxidizing agent.