Title:
支持体へのパウダーの静電浸透
Document Type and Number:
Japanese Patent JP2004502051
Kind Code:
A
Abstract:
The use of electrostatic impregnation to load materials such as binders and flavors onto substrates such as fibers and medical devices is disclosed. Substrates loaded with materials such as binders and flavors, wherein the materials are loaded on the substrates via electrostatic impregnation are also disclosed.
Inventors:
Dave Bible Bupendra
Application Number:
JP2002506863A
Publication Date:
January 22, 2004
Filing Date:
June 05, 2001
Export Citation:
Assignee:
JOHNSON & JOHNSON,CONSUMER,COMPANIES,INC.
International Classes:
B32B7/02; A61C15/04; A61L17/14; A61L27/54; A61L31/16; B05D1/06; B29B15/10; B32B27/00; D06M10/02; D06M10/10; D06M15/05; D06M15/09; D06M15/227; D06M15/507; D06M15/53; D06M15/693; D06M23/08; D06M101/18; D06M101/22; D06M101/32; D06M101/34; (IPC1-7): D06M15/53; B32B7/02; B32B27/00; D06M10/02; D06M15/05; D06M15/227
Attorney, Agent or Firm:
Hiroaki Tazawa
Konobu Kato
Konobu Kato