PURPOSE: To provide an electrostatically joining method of a silicon plate with a glass plate which can achieve improvement of the productivity, reduction of the cost, etc., based on both improvement of the productivity and improvement of the yield rate.
CONSTITUTION: A dummy glass 18 is made to lie between a glass plate and minus electrodes 12, 13 to abut against that. Further, it is possible (1) that minus electrodes 12, 13 are made of gold or platinum, (2) that the minus electrode is made to be a gold or platinum thin film formed on the dummy glass, or (3) that the gold or platinum thin film is formed on the dummy glass and a gold foil or a platinum foil is made to lie between this thin film and a minus electrode lead rod by being made to conform with a material of the thin film.
IKEDA AKI
SASAKI KOSUKE
