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Title:
楕円状をなすマイクロキャビティプラズマ素子およびパウダーブラスト製法
Document Type and Number:
Japanese Patent JP5486002
Kind Code:
B2
Abstract:
The invention provides microcavity plasma devices and arrays that are formed in layers that also seal the plasma medium, i.e., gas(es) and/or vapors. No separate packaging layers are required and additional packaging can be omitted if it is desirable to do so. A preferred microcavity plasma device includes first and second thin layers that are joined together. A half ellipsoid microcavity or plurality of half ellipsoid microcavities is defined in one or both of the first and second thin layers, and electrodes are arranged with respect to the microcavity to excite a plasma within said microcavities upon application of a predetermined voltage to the electrodes. A method for forming a microcavity plasma device having a plurality of half or full ellipsoid microcavities in one or both of first and second thin layers is also provided by a preferred embodiment. The method includes defining a pattern of protective polymer on the first thin layer. Powder blasting forms half ellipsoid microcavities in the first thin layer. The second thin layer is joined to the first layer. The patterning can be conducted lithographically or can be conduced with a simple screen.

Inventors:
Eden, Jay Gary
Park, Sun-jin
Sun, Song Hong
Application Number:
JP2011528086A
Publication Date:
May 07, 2014
Filing Date:
September 23, 2009
Export Citation:
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Assignee:
The Board of Trustees of the University of Illinois
International Classes:
H01J11/18; H01J9/02; H01J17/16; H01J17/49
Domestic Patent References:
JP10223135A
JP9283032A
JP3155024A
JP2004523453A
JP2009524204A
JP9283030A
JP2004055495A
JP10040808A
JP2007521985A
Foreign References:
US4853590
Attorney, Agent or Firm:
Kimura Mitsuru
Takanori Mamoru
Taiji Morikawa



 
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