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Title:
EMBOSSING APPARATUS
Document Type and Number:
Japanese Patent JP2011136461
Kind Code:
A
Abstract:

To provide an embossing apparatus improving the productivity and allowing preferable transferring.

A transferring device 3 of the embossing apparatus 1 has a movable embossing mold 32 with an embossing pattern formed on a surface. A support device 4 has rolls 41A-41C and a belt 42 wound around rolls 41A-41C and sandwiching a screen 100 with a part of an outer peripheral face 421 and the emboss mold 32, and a part of the belt 42 is moved along the moving direction of the emboss mold 32 by the rotation of the roll 41A-41C. Motors 35A, 35B, 45A-45C move the emboss mold 32 and the belt 42. The belt 42 is disposed so that a part of the outer peripheral face 421 follows the shape of the mold face 321 of the emboss mold 32. Rolls 31A, 41A, 41C and a heating unit 5 heat a part sandwiched between the emboss mold 32 and a part of the outer peripheral face 421 of the belt 42 in the screen 100.


Inventors:
KITABAYASHI MASASHI
Application Number:
JP2009297058A
Publication Date:
July 14, 2011
Filing Date:
December 28, 2009
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B29C59/04; B31F1/07
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Kazuhiko Miyasaka