Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
EMITTER ELECTRODE LEAD-OUT WIRING AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH0645345
Kind Code:
A
Abstract:

PURPOSE: To provide structure and manufacture which never causes step cutting or partially thins the thickness of wiring, in the emitter electrode lead-out wiring of a hetero-junction bipolar transistor(HBT).

CONSTITUTION: After formation of an emitter electrode 8 and an emitter mesa, Si3N4 film 10 is stacked, and a resist 11 is patterned, and the window of an Si3N4 film 10 is opened by dry etching, and a lead-out wiring 12 connected with it is manufactured. Hereby, the irregularity at the section in which to form an emitter electrode lead-out wiring can be made small, so an emitter electrode lead-out wiring, which never causes the step cutting of the lead wire or partially thins the thickness of the lead-out wiring, can be manufactured easily.


Inventors:
YANAGIHARA MANABU
OTA TOSHIMICHI
Application Number:
JP19669692A
Publication Date:
February 18, 1994
Filing Date:
July 23, 1992
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L29/205; H01L21/331; H01L29/73; H01L29/737; (IPC1-7): H01L21/331; H01L29/205; H01L29/73
Attorney, Agent or Firm:
Akira Kobiji (2 outside)