Title:
封止材組成物および封止材
Document Type and Number:
Japanese Patent JP6919886
Kind Code:
B2
Abstract:
To provide a sealing material composition having a predetermined thixotropy without adding a thixotropy imparting agent composed of an inorganic filler such as silica and an organic thickener such as amide wax.SOLUTION: A sealing material composition contains one or two or more monofunctional acryl monomers, a photoradical polymerization initiator, and a styrenic elastomer, as essential components, where, a three-dimensional distance calculated from a Hansen solubility parameter of the monofunctional acryl monomer and a Hansen solubility parameter of a soft segment in the styrenic elastomer is set within a predetermined range.SELECTED DRAWING: None
Inventors:
Aizawa Makoto
Application Number:
JP2017105883A
Publication Date:
August 18, 2021
Filing Date:
May 29, 2017
Export Citation:
Assignee:
Sekisui Polymatec Co., Ltd.
International Classes:
C09K3/10; C08F2/44; C08F287/00
Domestic Patent References:
| JP2010180324A | ||||
| JP2010265412A | ||||
| JP2014095041A |
Foreign References:
| US20040034153 |
Attorney, Agent or Firm:
Shogo Otake