Title:
電子部品の封止体
Document Type and Number:
Japanese Patent JP7371613
Kind Code:
B2
Abstract:
To provide a sealing body of an electronic component that is excellent in durability against an external environment factor of an electromagnetic wave shield layer.SOLUTION: A sealing body of an electronic component has an electronic component. The electronic component is sealed with a resin molding containing an electromagnetic wave-shielding layer that is formed on the surface of the electronic component of a resin composition for insert molding containing a resin and an electromagnetic wave-shielding filler. In a cross section of the resin molding in a direction vertical to the surface of the electronic component, the number A (piece/40,000 μm2) of the electromagnetic wave-shielding fillers per 200 μm square in a region closer to the surface of the electronic component is 1.05 times or more the number B (piece/40,000 μm2) of the electromagnetic wave-shielding fillers per 200 μm square in a region closer to the surface of the resin molding.SELECTED DRAWING: Figure 1
Inventors:
Ryo Hamasaki
Application Number:
JP2020218278A
Publication Date:
October 31, 2023
Filing Date:
December 28, 2020
Export Citation:
Assignee:
Toyobo MC Co., Ltd.
International Classes:
H01L23/29; C08K7/02; C08L101/00; H01L23/00; H01L23/31
Domestic Patent References:
| JP2007287937A | ||||
| JP2001237352A | ||||
| JP2002324877A | ||||
| JP2006160560A | ||||
| JP2002363382A |
Attorney, Agent or Firm:
Patent Attorney Corporation ASFI International Patent Office