Title:
封止フィルム、有機エレクトロルミネッセンス表示装置及び有機半導体デバイス
Document Type and Number:
Japanese Patent JP6524915
Kind Code:
B2
Abstract:
A sealing film including a substrate film, a sealing layer, and an adhesive layer in this order, wherein the sealing film has a tensile elastic modulus of equal to or higher than 1,000 MPa, and retardation of a layer portion provided at the sealing layer side relative to the substrate film in the sealing film after sealing is equal to or smaller than 20 nm.
Inventors:
Satoshi Tasaki
Hiroyasu Inoue
Atsushi Ishiguro
Youhei Koide
Hiroyasu Inoue
Atsushi Ishiguro
Youhei Koide
Application Number:
JP2015555020A
Publication Date:
June 05, 2019
Filing Date:
December 25, 2014
Export Citation:
Assignee:
Zeon Corporation
International Classes:
H05B33/04; B32B7/022; B32B7/023; H01L51/50
Domestic Patent References:
| JP2014180794A | ||||
| JP2013103373A | ||||
| JP2003163078A | ||||
| JP2005129520A | ||||
| JP2010080293A |
Foreign References:
| WO2013147093A1 | ||||
| WO2014091941A1 | ||||
| WO2013084836A1 |
Attorney, Agent or Firm:
Hiroaki Sakai