Title:
低次元構造体のカプセル化、転移方法
Document Type and Number:
Japanese Patent JP2010506735
Kind Code:
A
Abstract:
A method of encapsulating low dimensional structures comprises forming a first group (3a) of low dimensional structures (1) and a second group (3b) of low dimensional structures (1) on a first substrate. The first group (3a) of low dimensional structures (1) and the second group (3b) of low dimensional structures (1) are encapsulated in a matrix (5), with the first group (3a) of low dimensional structures (1) being encapsulated separately from the second group (3b) of low dimensional structures (1). After encapsulation, the first group (3a) of low dimensional structures (1) may be separated from the second group (3b) of low dimensional structures (1). Each group may then be processed, for example by transfer to a second substrate (7). The number of low dimensional structures in a group, and the aspect ratio of a group is defined when the low dimensional structures are formed, and can therefore be controlled more accurately than in a conventional method in which groups are defined using a patterning technique.
Inventors:
Stefan Day
Thomas Heinz-Helmut Arte Boima
Jonathan Hefanan
Thomas Heinz-Helmut Arte Boima
Jonathan Hefanan
Application Number:
JP2009514587A
Publication Date:
March 04, 2010
Filing Date:
October 11, 2007
Export Citation:
Assignee:
Sharp Corporation
International Classes:
B82B3/00; B82B1/00; H01L21/8247; H01L27/115; H01L29/06; H01L29/78; H01L29/786; H01L29/788; H01L29/792; H01L31/04; H01L31/10; H01L33/02; H01L33/20; H01S5/40; H01L33/54
Domestic Patent References:
| JP2006128233A | 2006-05-18 | |||
| JP2006295120A | 2006-10-26 | |||
| JP2006270041A | 2006-10-05 | |||
| JP2005059125A | 2005-03-10 | |||
| JP2001057146A | 2001-02-27 |
Foreign References:
| WO2005119753A2 | 2005-12-15 | |||
| WO2005017962A2 | 2005-02-24 | |||
| US6383923B1 | 2002-05-07 | |||
| US6996147B2 | 2006-02-07 | |||
| WO2005119753A2 | 2005-12-15 |
Attorney, Agent or Firm:
Kenzo Hara International Patent Office