PURPOSE: To reduce the diameter and size of an image pickup device part by coating the light receiving part of a semiconductor image sensor chip directly with a transparent protection layer and fitting a printed board directly on the reverse surface, and fixing the chip to the tip constitution member of an endoscope by a fixing member.

CONSTITUTION: The semiconductor image sensor chip 6 is joined directly with the 1st printed board 7 and covered directly with cover glass 9. A cylindrical member 11 is adhered by making the flange 12 abut on the cover glass 9 and fixed by fitting the other end part in the hole part 3a of a main member body 3. Further, an adhesive 22 is charged except in th cylindrical member 11 without any gap. Consequently, the image pickup device part is made thin and reduced in size and the tip hard part 1 of the endoscope insertion part where the image pickup device is incorporated is made thin and short.