PURPOSE: To subject a work piece to local depth processing according to an irradiation quantity by irradiating this work piece with an energy beam via a mask.
CONSTITUTION: The work piece 12 is irradiated with the energy beam through a beam transmission hole 14a formed at a mask 14 and at this time, the specific region of the work piece 12 is processed to the depth meeting the irradiation quantity of the energy beam by controlling the relative positions of the mask 14 and the work piece 12. As a result, the production of the work piece locally varying in the processing depth is extremely easy unlike the conventional lithography technique of forming the substrate surface having three-dimensional ruggedness by repeating stages, such as applying of resist, exposing and developing. In addition, the processing to the desired depth is made possible in a short period of time by one time of processing.
ICHIKI KATSUNORI
OBATA TADASUKE
HATAMURA YOTARO
NAKAO MASAYUKI
HATAMURA YOTARO
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