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Title:
エレクトロニクスアセンブリのための工学的材料
Document Type and Number:
Japanese Patent JP2024515499
Kind Code:
A
Abstract:
電子アセンブリにおいて使用するためのはんだ材料であって、はんだ材料が、はんだ層と、コア材料を含むコア層であって、はんだ層の間に挟まれている、コア層と、を含み、コア材料の熱伝導率が、はんだの熱伝導率よりも大きい、はんだ材料。【選択図】図３

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Inventors:
pandale, ranjit
Nagarajan, Nividita
Sidon, Girard
Birgrien, Karl
Application Number:
JP2023560315A
Publication Date:
April 10, 2024
Filing Date:
April 14, 2022
Export Citation:
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Assignee:
ALPHA ASSEMBLY SOLUTIONS INC.
International Classes:
B23K35/14; B23K1/00; B23K1/005; B23K3/04; B23K35/26; C22C12/00; C22C13/00; C22C13/02; C22C28/00
Attorney, Agent or Firm:
Norito Yamao
Haruhiko Ema
Masayuki Shikimi
Ken Takaoka
Patent Attorney Corporation NIP&SBPJ International Patent Office



 
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