PURPOSE: To prevent increase in defect at description by vapor-depositing the 1st metal on a photo resist film masked by a holed plate, removing the mask and vapor-depositing the 2nd metal on the entire film face.
CONSTITUTION: After a pit and a signal are formed on a photo resist film 2 on a base 1, the film 2 is masked by a mask 4 having holes in the form of manufacturer's serial number of stamper while the characters are upset, the 1st metal such as copper is vapor-deposited to form a metallic thin film 7 having a prescribed thickness is formed in the form of the manufacturer's serial number. Then the mask 4 is removed, and the 2nd metal having a different color, e.g., nickel is vapor-deposited on the entire film 2 to form a metallic thin film 8 having a prescribed thickness. In using the metallic thin film 8 as the cathode, nickel plating is applied to form a plating plate 9, then the metallic thin films 7, 8 and the plating plate 9 are formed incorporatedly, they are exfoliated from the base 1 and the film 2 to obtain a stamper 10. Thus, increase in defects at manufacture number description is prevented.