Title:
EPOXY ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP3411227
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a composition excellent in impact resistance, thermostability and water-resistance which shows excellent adhesion to a coated steel plate without needing a pre-treatment process by incorporating a main agent composed of an epoxy resin as a main component and a curing agent composed of an urethane-modified epoxy resin, a dialkylaminopropylamine and a polyamide amine as main components.
SOLUTION: A composition contains a main agent (e.g. bisphenolA/diglycidyl ether resin) composed of an epoxy resin as a main component and a curing agent composed of preferably 5-30 wt.% of an urethane-modified epoxy resin, preferably 4-20 wt.% of a dimethylaminopropylamine and/or diethylaminopropylamine and preferably 50-80 wt.% of a polyamideamine as main components. A blending ratio (weight ratio) of main agent/curing agent is preferably 5/1-1/5. The composition does not need any solvents, leading to no problems on environmental hygiene.
Inventors:
Total Hattori
Application Number:
JP29885798A
Publication Date:
May 26, 2003
Filing Date:
October 20, 1998
Export Citation:
Assignee:
Japan NSC Co., Ltd.
International Classes:
C08G59/50; C08G59/54; C09J163/00; C09J177/00; (IPC1-7): C09J163/00; C09J177/00
Domestic Patent References:
| JP5054627A | ||||
| JP6377983A |
Attorney, Agent or Firm:
Yukihiko Saitou