PURPOSE: To obtain the epoxy adhesive film which is excellent in heat resistance, adhesive properties, and electrical characteristics by using a linear high- mol.-wt. epoxy polymer produced by a specific method.
CONSTITUTION: A soln. of a high-mol.-wt. epoxy polymer is obtd. by thermally polymerizing a diepoxy resin with a dihydric phenol in an equivalent ratio of the epoxy group to the phenolic hydroxyl group of (1:0.9)-(1:1.1) in the presence of a catalyst in an amide or ketone solvent having a b.p. of 130°C or higher under such a condition that the concn. of solid components in the reaction mixture is 50wt.% or lower. This film is produced by compounding the soln., a poly-functional epoxy resin, a curing agent, and an electroless plating catalyst and molding the resulting compsn. by casting.
SHIBATA KATSUJI
FUJIOKA ATSUSHI
YOKOTA MITSUO
