Title:
EPOXY COMPOUND AND CURED PRODUCT OF EPOXY RESIN
Document Type and Number:
Japanese Patent JP2006273989
Kind Code:
A
Abstract:
To provide a new epoxy compound having a low melting point and providing a raw material for a cured product of an epoxy resin.
The new epoxy compound is represented by formula (1) {wherein, R1, R2, R3, R4, R5and R6 are each the same or different and represent each a hydrogen atom, a halogen atom, a 1-8C alkyl group or a 1-8C alkoxy group; and Z represents a 2-18C linear or a 2-18 branched chain alkylene group (wherein, one or non-adjacent two or more methylene groups constituting the 2-18C linear or 2-18C branched chain alkylene group may be substituted with an oxygen atom)}.
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Inventors:
HIBINO HIROAKI
Application Number:
JP2005094045A
Publication Date:
October 12, 2006
Filing Date:
March 29, 2005
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08G59/04; C07D303/28; C08J5/24; C08L63/00
Domestic Patent References:
| JPH08134173A | 1996-05-28 | |||
| JP2005171235A | 2005-06-30 |
Attorney, Agent or Firm:
Takashi Kuboyama
Toru Nakayama
Masayuki Enomoto
Toru Nakayama
Masayuki Enomoto
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