Title:
EPOXY COMPOUND, CURABLE COMPOSITION AND CURED PRODUCT
Document Type and Number:
Japanese Patent JP2023145207
Kind Code:
A
Abstract:
To provide an epoxy compound that yields a cured product with a good balance between low dielectric properties and reactivity.SOLUTION: An epoxy compound is represented by the following formula (1) (where, R1 and R2 independently represent a hydrocarbon group, which may include oxygen atoms, and the sum of the number of carbon atoms in a hydrocarbon group represented by R1 and the number of carbon atoms in a hydrocarbon group represented by R2 is 20 or more and 40 or less).SELECTED DRAWING: Figure 1
Inventors:
KAMEYAMA ATSUSHI
TAKASHIMA TSUTOMU
TAKASHIMA TSUTOMU
Application Number:
JP2022052561A
Publication Date:
October 11, 2023
Filing Date:
March 28, 2022
Export Citation:
Assignee:
ENEOS CORP
International Classes:
C08G65/02; C07D303/36; C08G59/40
Attorney, Agent or Firm:
Yukitaka Nakamura
Kazuma Kojima
Kazuma Kojima
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