PURPOSE: The titled molding material that is obtained by adding a specific amount of a specific fluorine resin which has a specific particle size and a melting point, thus being suitable for use in VLSI products and FP molding products, because it exerts low stress on insert products and shows high humidity and heat resistance.
CONSTITUTION: An epoxy resin containing curing agents and curing accelerators is combined with 0.1W10wt% of a powder of fluorine resin which is prepared by polymerization of a monomer in which at least one of H atoms in ethylene is substituted with fluorine atoms or fluorine-containing groups such as polytetrafluoroethylene with particle sizes of less than 100μm, preferably 1W20μm and a melting point of higher than 250°C, and is previously treated with a silane coupling agent.
FURUSAWA FUMIO
KUBO ETSUJI
