Title:
EPOXY RESIN ADHESIVE FOR FLEXIBLE PRINTED WIRING CIRCUIT
Document Type and Number:
Japanese Patent JP2001115126
Kind Code:
A
Abstract:
To prepare an epoxy resin adhesive which exerts a high adhesion strength, has a good heat resistance and toughness and is especially suitable for preparing flexible printed wiring circuits.
This epoxy adhesive comprises one or more epoxy resins, a hardener, a specific rubber and, optionally, an inorganic filler and a hindered piperidine oxide.
Inventors:
KYU KENKA
SON TOKUSO
SAI GAFUN
CHIN SENGYOKU
SON TOKUSO
SAI GAFUN
CHIN SENGYOKU
Application Number:
JP29373999A
Publication Date:
April 24, 2001
Filing Date:
October 15, 1999
Export Citation:
Assignee:
TAKYO KAGI KOFUN YUGENKOSHI
International Classes:
H05K1/03; C09J109/02; C09J109/06; C09J163/00; C09J183/04; (IPC1-7): C09J163/00; C09J109/02; C09J183/04
Attorney, Agent or Firm:
Shoichi Monma
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