Title:
EPOXY RESIN COMPOSITION, EPOXY ADHESIVE, COVER LAY, PREPREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2008001807
Kind Code:
A
Abstract:
To provide an epoxy resin composition and an epoxy adhesive having excellent migration resistance and high adhesion strengths, as well as a flexible cover lay, a prepreg, a metal-clad laminate and a printed circuit board using the epoxy resin composition or the epoxy adhesive.
This epoxy resin composition or this epoxy adhesive comprises a base resin containing an epoxy resin and a hardener, a carboxylated nitrile-butadiene rubber and an aromatic tetracarboxylic anhydride as components, wherein an amount of the aromatic tetracarboxylic anhydride is 100 ppm and 5,000 ppm based on 1 of the total amount of a solid content of the components.
Inventors:
NAKAMURA SHOICHIRO
Application Number:
JP2006172841A
Publication Date:
January 10, 2008
Filing Date:
June 22, 2006
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
C08L63/00; C08J5/24; C08K5/12; C08L13/00; H05K3/28; C08G59/40
Domestic Patent References:
| JPH11343476A | 1999-12-14 | |||
| JPH08157621A | 1996-06-18 | |||
| JPH09260851A | 1997-10-03 | |||
| JPH09260850A | 1997-10-03 | |||
| JP2002020459A | 2002-01-23 | |||
| JP2004346092A | 2004-12-09 | |||
| JPH09143249A | 1997-06-03 | |||
| JPH07228716A | 1995-08-29 |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama