Title:
EPOXY RESIN COMPOSITION FOR CASTING AND ELECTRIC- ELECTRONIC PART DEVICE
Document Type and Number:
Japanese Patent JP3949436
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has excellent coil impermeability and curing agent component storage stability, even when the epoxy resin-curing agent component is charged with an inorganic filler.
SOLUTION: This epoxy resin composition for casting, comprising a main agent component which comprises (A) an epoxy resin and (B) silica powder, and a curing agent component which comprises (C) an acid anhydride curing agent, (D) silica powder, (E) a curing accelerator and (F) a polyether-ester type surfactant, is characterized in that the main agent component is mixed with the curing agent component, when cast. An electric-electronic part device cast with the composition.
Inventors:
Takanari Kayamori
Application Number:
JP2001353917A
Publication Date:
July 25, 2007
Filing Date:
November 20, 2001
Export Citation:
Assignee:
Kyocera Chemical Co., Ltd.
International Classes:
C08L63/00; C08K3/36; C08L71/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08K3/36; C08L71/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP7228757A | ||||
| JP2000178415A |
Attorney, Agent or Firm:
Saichi Suyama
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