Title:
EPOXY RESIN COMPOSITION FOR CONDUCTIVE POURED FLOORING
Document Type and Number:
Japanese Patent JPH04224858
Kind Code:
A
Abstract:
PURPOSE:To prepare the title compsn. contg. small amts. of volatile solvents which worse to work environment in applying the compsn. and giving, when cured, a conductive poured flooring having an excellent appearance and a surface resistance lower than 10<9>OMEGA. CONSTITUTION:The title compsn. of a two-component type is prepd. by compounding 100 pts.wt. epoxy resin (typically a bisphenol A epoxy resin), 10-50 pts.wt. white conductive fiber (e.g. a conductive whisker), and a curing agent which cures the resin at room temp. (e.g. a modified aliph. polyamine).
Inventors:
WATANABE HIROYUKI
Application Number:
JP40790090A
Publication Date:
August 14, 1992
Filing Date:
December 27, 1990
Export Citation:
Assignee:
YOKOHAMA RUBBER CO LTD
International Classes:
C08K7/04; C08G59/00; C08L63/00; C09D163/00; E04F15/12; E04F15/18; (IPC1-7): C08K7/04; C08L63/00; C09D163/00; E04F15/12; E04F15/18
Attorney, Agent or Firm:
Nobuto Watanabe (1 person outside)