Title:
EPOXY RESIN COMPOSITION AND CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2014237861
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a siloxane structure-containing epoxy resin composition excellent in thermal stability, and a cured product thereof.SOLUTION: The epoxy resin composition contains an organopolysiloxane (A) and a light stabilizer (B) as essential components, where the organopolysiloxane (A) and the light stabilizer (B) satisfy the following conditions: the organopolysiloxane (A) is an epoxy resin having at least a glycidyl group and/or an epoxycyclohexyl group in its molecule; and the light stabilizer (B) is a hindered amine having a piperidine structure.
Inventors:
NAKANISHI MASATAKA
KAWADA YOSHIHIRO
SASAKI TOMOE
AOKI SHIZUKA
MIYAGAWA NAOFUSA
KUBOKI KENICHI
SUZUKI ZUIKAN
SHODA MASATO
KOYANAGI TAKAO
KAWADA YOSHIHIRO
SASAKI TOMOE
AOKI SHIZUKA
MIYAGAWA NAOFUSA
KUBOKI KENICHI
SUZUKI ZUIKAN
SHODA MASATO
KOYANAGI TAKAO
Application Number:
JP2014197132A
Publication Date:
December 18, 2014
Filing Date:
September 26, 2014
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
C08L63/00; C08G77/14; C08K5/3435; C08L83/06; C08L83/10
Domestic Patent References:
| JP2006328231A | 2006-12-07 | |||
| JP2009275206A | 2009-11-26 |
Foreign References:
| WO2005100445A1 | 2005-10-27 | |||
| WO2009072632A1 | 2009-06-11 | |||
| WO2008090971A1 | 2008-07-31 |
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