Title:
EPOXY RESIN COMPOSITION AND CURED ARTICLE PREPARED THEREFROM
Document Type and Number:
Japanese Patent JPH1171499
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To obtain an epoxy resin compsn. having a high resistance and improve dielectric properties by incorporating a methine-bonded type alkylated polyfunctional epoxy resin, a curing agent comprising a compd. having active ester groups and a cure accelerator into the same. SOLUTION: This compsn. contains 100 pts.wt. epoxy resin mixture comprising a methine-bonded type alkylated polyfunctional epoxy resin represented by formula I having at least two epoxy groups, a phenol novolak epoxy resin, etc., 50-150 pts.wt. mixture comprising a compd. represented by formula II having active ester groups (e.g. an acetylated phenol novolak resin) and a phenol novolak as the curing agent, a cure accelerator in an amt. of 0.1-5 pts.wt. based on 100 pts.wt. total resin components, and required amts. of a brominous flame retardant and an inorg. filler (e.g. fused silica). In the formula I, R1 is H or a 1-4C alkyl; and n is 0-10. In the formula II, R1 and R2 are each H or a 1-4C alkyl; X is a 1-4C alkyl or the like; and n and m are each 1-10.
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Inventors:
TOMIOKA KENICHI
SASE SHIGEO
TAKANO MARE
FUKUDA TOMIO
ARATA MICHITOSHI
MIZUNO YASUYUKI
SASE SHIGEO
TAKANO MARE
FUKUDA TOMIO
ARATA MICHITOSHI
MIZUNO YASUYUKI
Application Number:
JP23341997A
Publication Date:
March 16, 1999
Filing Date:
August 29, 1997
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08K5/3445; C08G59/32; C08G59/50; C08G59/62; C08L63/00; (IPC1-7): C08L63/00; C08G59/32; C08G59/50; C08G59/62; C08K5/3445
Attorney, Agent or Firm:
Kunihiko Wakabayashi