Title:
EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
Japanese Patent JP2014005383
Kind Code:
A
Abstract:
To provide an epoxy resin composition, which is suitable for many applications, including for power semiconductors, and gives a cured product improved in both thermostability and moisture resistance reliability, while having storage stability and quick curability contributing to improvement in work efficiency.
An epoxy resin composition at least contains a naphthalene type tetrafunctional epoxy resin of the following formula (1), a curing agent, and a phosphorus-based curing accelerator including one or more tetra aryl phosphonium tetraphenylborate adduct.
Inventors:
KITAMURA AI
OHASHI KENJI
OGA MASANORI
OHASHI KENJI
OGA MASANORI
Application Number:
JP2012142472A
Publication Date:
January 16, 2014
Filing Date:
June 25, 2012
Export Citation:
Assignee:
HOKKO CHEM IND CO
International Classes:
C08G59/32; C08K3/22; C08K3/26; C08K3/34; C08K3/36; C08K5/16; C08L61/10; C08L63/00
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