Title:
EPOXY RESIN COMPOSITION AND CURED PRODUCT
Document Type and Number:
Japanese Patent JP2022007115
Kind Code:
A
Abstract:
To provide an epoxy resin composition which is excellent in handleability and moldability at normal temperatures, has a high coefficient of thermal conductivity when being compounded with an inorganic filler, and gives a molded product having low thermal expansion and excellent heat resistance and humidity resistance, and a cured product using the same.SOLUTION: An epoxy resin composition contains an epoxy resin and a curing agent or an inorganic filler with them, as main components, and contains 1-40 pts.wt. of an aromatic diol compound that is solid at normal temperatures and is represented by the following general formula (1) or (2) with respect to 100 pts.wt. of the epoxy resin, as a modifier.SELECTED DRAWING: None
Inventors:
KAJI MASASHI
OGAMI KOICHIRO
OGAMI KOICHIRO
Application Number:
JP2020109848A
Publication Date:
January 13, 2022
Filing Date:
June 25, 2020
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD
International Classes:
C08G59/40; C08J5/24; C08K3/013; C08K3/22; C08K3/38; C08L63/00; H01L23/14; H01L23/29
Attorney, Agent or Firm:
Kazuya Sasaki
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Naruse Katsuo
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Naruse Katsuo