To provide an epoxy resin composition for encapsulation that is an encapsulation material that is used in a package method in which encapsulation of a gap part of a semiconductor element and a substrate, and encapsulation of a semiconductor device itself are simultaneously performed by transfer molding, generation of burr at molding is suppressed, that has a high thermal conductivity characteristic, and in which a filling property of the gap part is excellent; and a semiconductor device using the same.
An epoxy resin composition for encapsulation for transfer molding of a semiconductor device in which a flip chip packaging is used includes: (A) an epoxide resin; (B) a curative; (C) a cure assistant, and (D) an inorganic filling agent as an essential component, wherein (D) the inorganic filling agent is included by a range of 75-95 mass% of the whole resin composition, and the (D) includes at least 60 vol.% of alumina, and includes at least 99.9 vol.% of a particle in which a particle diameter is at most 32 μm, and includes at least 5 vol.% of a particle in which a particle diameter is at most 0.5 μm, and has particle size distribution in which an average particle diameter is in a range of 1-10 μm.
TSUJI TAKAYUKI
IWATANI EMI
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