Title:
エポキシ樹脂組成物及びこれを用いたエポキシ樹脂ワニス、ボンディングシート、カバーレイフィルム
Document Type and Number:
Japanese Patent JP5651641
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in flexibility and flame retardancy, and to provide an epoxy resin varnish, a bonding sheet and a cover-lay film using the composition.SOLUTION: The epoxy resin composition comprises (a) an epoxy resin, (b) a curing agent and (c) a phenolic hydroxy group-containing aromatic polyamide-polybutadiene-acrylonitrile copolymer. In the composition: the (a) component is a trishydroxyphenylmethane type epoxy resin; the (b) component is composed of 10(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide only; phenolic hydroxy groups in the (b) component are included by 0.5 mol or more with respect to 1.0 mol of epoxy groups in the (a) component; and the compounding rate of the (c) component is 5 to 300 pts.mass with respect to 100 pts.mass of the total of the (a) component and the (b) component.
Inventors:
福原 邦昭
菊池 秀樹
佐々木 文幸
山下 健太郎
菊池 秀樹
佐々木 文幸
山下 健太郎
Application Number:
JP2012158358A
Publication Date:
January 14, 2015
Filing Date:
July 17, 2012
Export Citation:
Assignee:
ソマール株式会社
International Classes:
C08G59/40; C08J7/04; C08K5/49; C08L63/00; C08L77/00; C09J7/02; C09J11/06; C09J163/00; C09J177/00; H05K3/28; H05K3/38
Attorney, Agent or Firm:
Ippei Watanabe