EPOXY RESIN COMPOSITION AND MATERIAL FOR FLEXIBLE PRINTED WIRING BOARD USING THE SAME

Title:

EPOXY RESIN COMPOSITION AND MATERIAL FOR FLEXIBLE PRINTED WIRING BOARD USING THE SAME

Document Type and Number:

Japanese Patent JP2005036126

Kind Code:

A

Abstract:

To provide an epoxy resin composition having excellent repeated flexing resistance, adhesiveness, heat resistance, moisture resistance, and electrical reliability, especially the electrical reliability at high temperature in high humidity, and hardly causing reduction of adhesive strength by repeated heat history; and to provide a flexible substrate for printed wiring, a cover lay material and a bonding sheet by using the composition.

The epoxy resin composition contains (a) an epoxy resin, (b) a curing agent, (c) a polyamide-poly(butadiene-acrylonitrile) copolymer having phenolic hydroxy group, and (d) an ion scavenger. The content of the ion scavenger (d) is 10-25 wt.% based on the amount of the epoxy resin composition (with the proviso that an organic solvent is excluded).

Inventors:

NAMIKI TSUTOMU
MORI NAOMI
SHODA MASATO

Application Number:

JP2003275493A

Publication Date:

February 10, 2005

Filing Date:

July 16, 2003

Export Citation:

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Assignee:

NIPPON KAYAKU KK

International Classes:

B32B15/092; B32B15/08; C08G59/62; C08K3/00; C08L63/00; C09J7/02; C09J11/04; C09J109/02; C09J153/00; C09J163/00; C09J177/00; H05K1/03; H05K3/28; (IPC1-7): C08G59/62; B32B15/08; C08K3/00; C08L63/00; C09J7/02; C09J11/04; C09J109/02; C09J153/00; C09J163/00; C09J177/00; H05K1/03; H05K3/28

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