Title:
EPOXY RESIN COMPOSITION, PREPREG AND LAMINATED BOARD
Document Type and Number:
Japanese Patent JP3945039
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having high storage stability in semicured state (B-stage).
SOLUTION: The objective epoxy resin composition is prepared by using an epoxy resin compound, a metal carboxylate, an aromatic polyamine and an imidazole compound as constituent components. The storage stability of the composition in semicured state (B-stage) can be improved by compounding a metal carboxylate and an aromatic polyamine as curing agents. Preferably, the epoxy resin compound is bisphenol A epoxy resin or a novolak epoxy resin and has an epoxy equivalent of 50-500 as a whole.
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Inventors:
Eiichiro Saito
Kamio Yonemoto
Yoshihide Sawa
Kengo Yamanouchi
Eiji Motobe
Mitsutoshi Kishino
Kamio Yonemoto
Yoshihide Sawa
Kengo Yamanouchi
Eiji Motobe
Mitsutoshi Kishino
Application Number:
JP27041598A
Publication Date:
July 18, 2007
Filing Date:
September 25, 1998
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
C08J5/24; C08L63/02; B32B15/08; B32B15/092; B32B27/38; C08G59/56; C08G59/68; (IPC1-7): C08G59/56; B32B27/38; C08G59/68; C08J5/24
Domestic Patent References:
| JP5097971A | ||||
| JP61272261A | ||||
| JP5339345A | ||||
| JP50024397A |
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori
Atsuo Mori