To provide an epoxy resin composition capable of finishing the curing in a short time even at a low temperature and obtaining a fiber-reinforced composite resin molded product having excellent mechanical properties, particularly excellent fracture toughness by being used as a matrix resin of a prepreg, the prepreg using the same and the fiber-reinforced composite resin molded product formed from the prepreg.
An epoxy resin composition comprises following components (A), (B), (C), (D) and (E). The component (A) is 40-60 pts.mass and the component (B) is 30-50 pts.mass per 100 pts.mass epoxy resin in the resin composition. The component (A) is an epoxy resin having at least one sulfur atom in the molecule. The component (B) is a bisphenol type epoxy resin having a molecular weight of 500-2,000. The component (C) is another epoxy resin, the component (D) is a polyamide compound soluble in the epoxy resin and the component (E) is a curing agent.
ISHIMOTO TOMOKO
KANEKO MANABU
| JPH08217854A | 1996-08-27 | |||
| JP2013159696A | 2013-08-19 | |||
| JPH09316302A | 1997-12-09 | |||
| JPH08217854A | 1996-08-27 | |||
| JP2013159696A | 2013-08-19 |
| WO2010023918A1 | 2010-03-04 | |||
| WO2008136096A1 | 2008-11-13 | |||
| WO2010023918A1 | 2010-03-04 | |||
| WO2008136096A1 | 2008-11-13 |