PURPOSE: To obtain an epoxy resin compsn. which has low viscosity, gives a cured article having excellent heat resistance and mechanical characteristics, and is suitable for applications, such as a sealing material for electronic parts, an insulating film, an electric laminate, an adhesive, and a matrix for fiberreinforced plastics, where products are produced by molding, casting, adhesion, lamination, etc., and to provide a process for producing a cured epoxy resin from the compsn.
CONSTITUTION: The production process comprises the steps of preparing an epoxy resin compsn. by mixing an epoxy resin, a curative and a reactive diluent contg. a tert. amine, molding the obtained compsn., and heat curing the molding. The epoxy resin compsn. comprises an epoxy resin, a curative, and a reactive diluent contg. a tert. amine.
SUGIYAMA HISASHI
KITAMURA NAOYA
