To obtain an epoxy resin composition excellent in workability in kneading and having low hygroscopicity and good heat resistance by using a phenolic curing agent having a low melt viscosity and a specified stilbene-base epoxy resin as the essential constituents.
This composition is obtained by using as the essential constituents a phenolic curing agent (e.g. a polyaralkyl phenolic resin) having a melt viscosity at 150°C of 1.5 P or lower and an epoxy resin which comprises at least one stilbene-base epoxy resin represented by formula I (wherein R1 to R8 are each a 1-6C aliphatic or cyclic aralkyl, H or halogeno; and two groups bounds to the carbon-carbon double bond are not the same) or a combination of a resin of formula I and at least one stilbene-base epoxy resin represented by formula II (wherein R9 to R16 are the same as R1 to R8; and two aryl groups bound to the carbon-carbon double bond are the same) and which has a melting point of 150°C or lower. This composition is suitable for sealing electronic parts.
HIRANO YASUHIRO
YOKOTA AKIRA
NAKAMURA HIROSHI
NAITO SHIGEKI
