To obtain an epoxy resin composition for sealing, excellent in laser marking property and electric characteristics, causing no short circuit due to electroconductive materials even in an electronic part device with a narrow interval between pads or wires and having excellent moldability, reliability and package surface externals, and to provide electronic part devices using the epoxy resin composition.
The epoxy resin composition for sealing comprises an epoxy resin, a curing agent, non-electroconductive carbon and an inorganic filler as essential ingredients, wherein the epoxy resin includes one or more epoxy resins of a biphenyl type represented by formula (I), a bisphenol F type represented by formula (II), a sulfur-containing type represented by formula (III) or a novolak type represented by formula (IV). In each formula, R1 to R16 and R are selected from H and 1-10C (substituted) hydrocarbons and may be same or different each other and (n) is an integer of 0-3 in formulas (I) and (II) and an integer of 1-10 in formulas (III) and (IV).
ABE HIDENORI
| JPH10335389A | 1998-12-18 | |||
| JPH098178A | 1997-01-10 | |||
| JPH02127449A | 1990-05-16 | |||
| JP2002348439A | 2002-12-04 | |||
| JPH02245055A | 1990-09-28 | |||
| JPH09194689A | 1997-07-29 | |||
| JPH0823005A | 1996-01-23 | |||
| JPH05175369A | 1993-07-13 | |||
| JPH09143251A | 1997-06-03 | |||
| JPH10330643A | 1998-12-15 | |||
| JPH10114873A | 1998-05-06 | |||
| JPH09309710A | 1997-12-02 | |||
| JPS62192460A | 1987-08-24 |
Yasuo Miyoshi
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu