Title:
EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JP2948362
Kind Code:
B2
Abstract:
PURPOSE: To obtain a composition, capable of enhancing adhesion to copper frames and excellent in moisture resistance and moldability by blending an epoxy resin with a phenolic novolak resin curing agent and a filler silica and further an aromatic aminosilane-based coupling agent.
CONSTITUTION: The objective composition is obtained by blending (A) an epoxy resin with (B) a phenolic novolak resin curing agent and (C) a filler and further (D) an aromatic aminosilane-based coupling agent expressed by the formula (R1)nC6H4-NH-R2Si(OR3) [R1 is (R4)3SlO- or H; R is lower alkylene; R3 and R4 are lower alkyl; (n) is 1-3] in an amount of normally 0.01-2 pts.wt. (preferably 0.1-1 pts.wt.) based on 100 pts.wt. component (C).
Inventors:
KAGAWA HIROHIKO
MYATANI YUKIHIRO
MYATANI YUKIHIRO
Application Number:
JP18271691A
Publication Date:
September 13, 1999
Filing Date:
July 23, 1991
Export Citation:
Assignee:
MATSUSHITA DENKO KK
International Classes:
C08G59/00; C08G59/62; C08K3/36; C08K5/54; C08K5/544; C08K13/02; C08L63/00; H01L23/29; C08G59/40; H01L23/31; (IPC1-7): C08L63/00; C08G59/62; C08K13/02; H01L23/29; H01L23/31
Domestic Patent References:
| JP286648A | ||||
| JP63196621A | ||||
| JP61136548A | ||||
| JP438856A | ||||
| JP63230729A |
Attorney, Agent or Firm:
Toshio Nishizawa