Title:
EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JPH02155917
Kind Code:
A
Abstract:
PURPOSE:To provide low elasticity without lowering glass transition temp. and to improve resistance to heat shock by compounding an epoxy resin, a phenol resin curing agent and a butadiene-acrylonitrile copolymer-modified organopolysiloxane. CONSTITUTION:A butadiene-acrylonitrile copolymer-modified organopolysiloxane is obtd. by reacting an organopolysiloxane (a) of a viscosity of 10,000-500,000cst and 2 or more epoxy groups in its molecule, an organopolysiloxane (b) of a wt. ratio a/b of 0.1-10, a viscosity of 10,000-500,000cst and 2 or more epoxy and polyoxyalkylene groups in its molecule and a butadiene-acrylonitrile copolymer (c) of a ratio of the intramolecular epoxy equivalent of the components (a) and (b) to the carboxyl equivalent of the component (c) of 0.05-0.5, an MW of 1,000-5,000 and an acrylonitrile content of 5-30wt.% and having carboxyl groups on both terminals in the presence of a catalyst at 120-180 deg.C for 2-10 hrs. An epoxy resin, a phenolic resin curing agent and the above organopolysiloxane are compounded and kneaded at 70-110 deg.C.
Inventors:
ENDO SHIGERU
NAKAMURA TAKAHITO
MIWA YOSHIYUKI
HAMAMOTO SHUNICHI
NAKAMURA TAKAHITO
MIWA YOSHIYUKI
HAMAMOTO SHUNICHI
Application Number:
JP30979188A
Publication Date:
June 15, 1990
Filing Date:
December 09, 1988
Export Citation:
Assignee:
UBE INDUSTRIES
International Classes:
C08L63/00; C08G59/00; C08G59/14; C08G59/20; C08G59/62; H01L23/29; H01L23/31; (IPC1-7): C08G59/20; C08G59/62; C08L63/00; H01L23/29; H01L23/31