Title:
EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JPH04328121
Kind Code:
A
Abstract:
PURPOSE:To provide a composition composed of a polyfunctional epoxy compound, an inorganic filler and a curing agent component containing a prescribed amount of a specific diphenol compound having imide ring and exhibiting excellent mechanical strength at high temperature, cold-heat shock resistance, toughness, moisture resistance and cracking resistance. CONSTITUTION:This composition is composed of (A) a polyfunctional epoxy compound, (B) an inorganic filler such as crystalline silica powder (the amount of the filler is preferably 50-85wt.% based on the composition) and (C) a curing agent component containing a curing agent such as 2-methylimidazole and 10-100% diphenol compound of formula (R is >=2C tetravalent aliphatic group, aromatic group, etc.), having imide ring and produced by condensing 2-(p- hydroxyphenyl)-2-(p-aminophenyl)propane and a tetracarboxylic acid dianhydride. The hydroxyl equivalent of the component C is preferably 0.8-1.2 equivalent based on 1 equivalent of the epoxy group of the component A. The compound of formula is preferably used by preparatorily mixing with a phenolic novolak resin in molten state.
Inventors:
TOUZAKI EIZOU
Application Number:
JP18838691A
Publication Date:
November 17, 1992
Filing Date:
April 26, 1991
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G59/62; C08G59/00; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/62; C08L63/00; H01L23/29; H01L23/31