Title:
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2000273279
Kind Code:
A
Abstract:
To obtain the subject composition excellent in high-temperature storage characteristics and in balance between the high-temperature storage characteristics and flame retardancy as well.
This epoxy resin composition is characterized by essentially comprising (A) an epoxy resin, (B) a phenolic resin, (C) 0.1-5 wt.% of active carbon, (D) an inorganic filler, (E) a curing promoter, (F) 0.1-5 wt.% of hydrotalcite compound(s), and (G) a brominated epoxy resin.
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Inventors:
FUJITA HIROSHI
Application Number:
JP8381799A
Publication Date:
October 03, 2000
Filing Date:
March 26, 1999
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08K3/00; C08G59/30; C08K3/04; C08K3/26; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/30; C08K3/00; C08K3/04; C08K3/26; H01L23/29; H01L23/31
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