Title:
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2001247653
Kind Code:
A
Abstract:
To provide an epoxy resin composition excellent in bonding strength to various base materials and soldering resistance.
There is provided a semiconductor-sealing epoxy resin composition comprising (A) a dicyclopentadiene-rnodified phenolic epoxy resin of formula (1), (B) a phenolic resin, (C) a silane coupling agent of formula (2), (D) an inorganic filler and (E) a curing accelerator as essential components, wherein the total epoxy resin composition contains 70-92 wt.% of the inorganic filler.
Inventors:
DEGUCHI SHINGO
Application Number:
JP2000064067A
Publication Date:
September 11, 2001
Filing Date:
March 08, 2000
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08K5/544; C08G59/20; C08G59/62; C08K5/548; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/20; C08G59/62; C08K5/544; C08K5/548; C08L63/00; H01L23/29; H01L23/31