To provide an epoxy resin composition which ensures small warpage after molding and in soldering, excels in soldering resistance and excels also in productivity, when used in a semiconductor device in which low warping property and smoothness are required, particularly an area mounting type semiconductor device or the like in which a resin layer is formed on one side of a substrate.

The epoxy resin composition includes a crystalline epoxy resin (A) having a melting point of 30-150C, a polyfunctional epoxy resin (B), a polyfunctional phenolic resin (C), a spherical inorganic filler (D), a flaky inorganic filler (E) and a curing accelerator (F), a spiral flow of the resin composition at 175C is 50 cm, and a Curelast torque value of the resin composition at 175C after the passage of 30 s after the beginning of measurement is 10 Nm.