Title:
エポキシ樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP4517433
Kind Code:
B2
Inventors:
Hideaki Sasashima
Application Number:
JP2000034503A
Publication Date:
August 04, 2010
Filing Date:
February 14, 2000
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/24; C08K3/00; C08G59/68; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2001040180A | ||||
| JP2001002755A | ||||
| JP2001089636A | ||||
| JP55157594A | ||||
| JP11067982A | ||||
| JP2000007761A | ||||
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| JP7206978A |